Automated Linescan Analysis for CMP Modeling
Keywords:CMP modeling, Linescan analysis, Erosion and dishing calculation
Many of the process steps used in semiconductor chip manufacturing require planar (smooth) surfaces on the wafer to ensure correct pattern printing and generation of multilevel interconnections in the chips during manufacturing. Chemical-mechanical polishing/planarization (CMP) is the primary process used to achieve these surface planarity requirements. Modeling of CMP processes allows users to detect and fix large surface planarity variations (hotspots) in the layout prior to manufacturing. Fixing hotspots before tape-out may significantly reduce turnaround time and the cost of manufacturing. Creating an accurate CMP model that takes into account complicated chemical and mechanical polishing mechanisms is challenging. Measured data analysis and extraction of erosion and dishing data from profile linescans from test chips are important steps in CMP model building. Measured linescans are often tilted and noisy, which makes the extraction of erosion and dishing data more difficult. The development and implementation of algorithms used to perform automated linescan analysis may significantly reduce CMP model building time and improve the accuracy of the models. In this work, an automated linescan analysis (ALSA) tool is presented that performs automated linescan delineation, test pattern separation, and automatic extraction of erosion and dishing values from linescan data.
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