Automated Linescan Analysis for CMP Modeling

Authors

  • Ruben G. Ghulghazaryan Mentor Graphics Development Services
  • Davit G. Piliposyan Mentor Graphics Development Services
  • Suren B. Alaverdyan Institute for Informatics and Automation Problems of NAS RA

DOI:

https://doi.org/10.51408/1963-0066

Keywords:

CMP modeling, Linescan analysis, Erosion and dishing calculation

Abstract

Many of the process steps used in semiconductor chip manufacturing require planar (smooth) surfaces on the wafer to ensure correct pattern printing and generation of multilevel interconnections in the chips during manufacturing. Chemical-mechanical polishing/planarization (CMP) is the primary process used to achieve these surface planarity requirements. Modeling of CMP processes allows users to detect and fix large surface planarity variations (hotspots) in the layout prior to manufacturing. Fixing hotspots before tape-out may significantly reduce turnaround time and the cost of manufacturing. Creating an accurate CMP model that takes into account complicated chemical and mechanical polishing mechanisms is challenging. Measured data analysis and extraction of erosion and dishing data from profile linescans from test chips are important steps in CMP model building. Measured linescans are often tilted and noisy, which makes the extraction of erosion and dishing data more difficult. The development and implementation of algorithms used to perform automated linescan analysis may significantly reduce CMP model building time and improve the accuracy of the models. In this work, an automated linescan analysis (ALSA) tool is presented that performs automated linescan delineation, test pattern separation, and automatic extraction of erosion and dishing values from linescan data.

References

M. Oliver, “Chemical-mechanical planarization of semiconductor materials”, Springer Science & Business Media, vol. 69, pp. 1-428, 2004.

R. Ghulghazaryan, J. Wilson and N. Takeshita, “CMP Model building and hotspot detection by simulation”, Proceedings of 158th Meeting of Planarization CMP Committee, Nagoya, Japan, vol. 55, pp. 55-59, 2017.

R. Ghulghazaryan, J. Wilson and N. Takeshita. “Building CMP models for cmp simulation and hotspot detection”, mentor.com, 2017.

R. Ghulghazaryan, J. Wilson and A. Abouzeid. “FEOL CMP modeling: Progress and challenges”, In 2015 ICPT, IEEE, pp. 1-4, 2015.

G. Moore, “Cramming more components onto integrated circuits”, Electronics, vol. 38, no 8, pp 114-117, 1965.

M. Krishnan, J. Nalaskowski and L. M. Cook, “Chemical mechanical planarization: slurry chemistry, materials, and mechanisms”, Chemical reviews, vol. 110, no. 1, pp. 178-204, 2010.

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Published

2020-12-25

How to Cite

Ghulghazaryan, R. G. ., Piliposyan, D. G. ., & Alaverdyan, . S. B. . (2020). Automated Linescan Analysis for CMP Modeling. Mathematical Problems of Computer Science, 54, 122–130. https://doi.org/10.51408/1963-0066